Gold Plated FPC BGA Reballing Stencil – CPU Chip Soldering Tool
Gold Plated FPC BGA Reballing Stencil – CPU Chip Soldering Tool
Gold Plated FPC Connector Reballing Stencil – Professional BGA Soldering Repair Tool
Take your phone motherboard repair work to the next level with this Gold Plated FPC Connector Reballing Stencil. Crafted from high-quality copper with a precision gold-plated finish, this soldering stencil is engineered for accurate, reliable BGA chip reballing on smartphones, tablets, and other compact electronic devices. Whether you're a professional technician or a skilled hobbyist, this tool delivers the consistency and durability your repair work demands.
Key Features
- Premium Copper Construction: High-conductivity copper base ensures excellent heat distribution for clean, precise solder joints every time.
- Gold Plated Surface: The gold plating resists oxidation and corrosion, extending the tool's lifespan and maintaining consistent performance across repeated uses.
- BGA & CPU Chip Compatible: Designed for reballing BGA chips, CPU chips, FPC connectors, and motherboard components commonly found in mobile phones and compact electronics.
- Generous Size: Measures 162 × 50 mm (approx. 6.37 × 1.96 in), providing ample coverage for a wide range of chip soldering and suction-tin operations.
- Suction Tin Ready: Compatible with standard solder suction (desoldering) workflows, making chip removal and reballing faster and more efficient.
- Brand New & High Quality: Each unit is inspected before shipment to ensure it meets professional repair standards.
Specifications
| Material | Copper (Gold Plated) |
| Size | 162 × 50 mm / 6.37 × 1.96 in |
| Quantity | 1 PC |
| Country of Origin | Made in Mainland China |
What's in the Package?
- 1 × Gold Plated FPC Connector Reballing Stencil
Important Notes
- Please refer to the listed dimensions rather than photos for sizing — product images may not reflect actual scale.
- Allow ±5–10 mm tolerance due to manual measurement.
- Colors may vary slightly due to monitor settings, lighting, and screen calibration.
Related Products You May Find Useful
- 1PC 10g High Grade Silicone Grease Lubricant for O-Rings & Tubes
- 3PCS Silicone Sealant Scraper Set – Multi-Functional Caulking Tools
- 1PC Multi-Use Faucet Bubbler Wrenches – 6 Sizes Repair Spanner
Learn more: OSHA guidance on hand and power tools
Frequently Asked Questions
Q: What devices is this FPC reballing stencil compatible with?
A: This gold plated reballing stencil is compatible with a wide range of smartphones, tablets, and compact electronic devices that use BGA chips, CPU chips, and FPC connectors on their motherboards. It is suitable for professional phone repair technicians as well as advanced DIY electronics enthusiasts.
Q: Why is gold plating important for a soldering stencil?
A: Gold plating provides excellent resistance to oxidation and corrosion, which keeps the stencil's surface clean and functional over many repeated uses. This ensures consistent solder flow and precise chip reballing results, making it far more durable than uncoated copper stencils.
Q: Can this tool be used for suction tin (desoldering) operations?
A: Yes. This stencil is designed to be compatible with standard solder suction workflows. It can assist in both removing existing solder (desoldering/suction tin) and applying fresh solder balls during the BGA reballing process.
Q: What is the exact size of this reballing stencil?
A: The stencil measures 162 × 50 mm (approximately 6.37 × 1.96 inches). Please note there may be a ±5–10 mm tolerance due to manual measurement methods.
Production & Packaging Notice
To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.