BGA Solder Balls 25K Sn63Pb37 0.2–0.76mm Reballing Kit

BGA Solder Balls – Precision Reballing Spheres for Electronic Repair

Get professional-grade BGA reballing results with this 25,000-piece bottle of Sn63Pb37 tin-lead eutectic solder balls. Available in diameters from 0.2mm to 0.76mm, these high-purity spheres are engineered for technicians who demand consistent, reliable solder joints on BGA chips, PCBs, and other surface-mount components.

Made in Mainland China.

Why Choose These BGA Solder Balls?

• Stable Eutectic Melting Performance: Sn63Pb37 alloy delivers a fixed 183°C melting point with uniform flow characteristics — eliminating cold or false solder joints and maximising your BGA rework success rate.
• Wide Diameter Range: Precision-manufactured in sizes from 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm to 0.76mm — compatible with virtually all mainstream BGA chip packaging specifications.
• 99.99% High-Purity Tin-Lead: Ultra-pure, impurity-free material ensures outstanding electrical conductivity and anti-oxidation properties for stable signal transmission and extended device service life.
• Tight Size Tolerance ±0.005mm: Every batch is professionally sorted so diameter variation stays within ±0.005mm, delivering uniform solder joint height and preventing short circuits or poor contacts.
• Dust-Proof & Moisture-Proof Storage: Sealed transparent plastic bottle keeps all 25,000 balls protected from oxidation. The clear design lets you monitor remaining stock at a glance — no surprises mid-job.

Product Specifications

Ideal For

• BGA chip reballing and rework
• PCB board repair and component replacement
• Electronics manufacturing and prototype assembly
• Laptop, smartphone, and gaming console motherboard repair
• Professional electronics technicians and hobbyists

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Frequently Asked Questions

Q: What alloy composition are these BGA solder balls made from?

A: These BGA solder balls are made from Sn63Pb37 (63% tin, 37% lead) eutectic alloy with 99.99% purity. This composition provides a consistent 183°C melting point, uniform flow, and excellent electrical conductivity — ideal for professional BGA chip reballing and PCB rework.

Q: Which diameter size should I choose for my BGA chip?

A: The correct diameter depends on your specific BGA chip's pad pitch and packaging specification. Common choices include 0.3mm–0.4mm for fine-pitch chips and 0.5mm–0.76mm for standard BGA packages. Always refer to your chip's datasheet or rework stencil specifications before selecting a size.

Q: How many solder balls are included in one bottle, and how are they stored?

A: Each bottle contains 25,000 BGA solder balls. They are packed in a sealed, transparent plastic bottle that is both dust-proof and moisture-proof, protecting the balls from oxidation during storage. The clear bottle also allows you to easily monitor the remaining quantity.

Q: Are these solder balls compatible with standard BGA reballing stencils?

A: Yes. With diameter options ranging from 0.2mm to 0.76mm and a tight tolerance of ±0.005mm, these solder balls are compatible with virtually all mainstream BGA reballing stencils and chip packaging formats used in laptop, smartphone, and gaming console motherboard repair.

Production & Packaging Notice

To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.