BGA Reballing Silicone Mat – Non-Slip Heat Resistant Rework Pad
BGA Reballing Silicone Mat – Non-Slip Heat Resistant Rework Pad
BGA Reballing Silicone Mat – The Essential Rework Workstation Pad
The PD-C Planting Tin Pad Reballing Platform Silicone Mat is a must-have accessory for electronics technicians and hobbyists working with CPU, IC, and BGA stencil rework. Crafted from high-quality silicone, this compact orange mat provides a stable, non-slip, and heat-resistant surface so your components stay exactly where you need them during soldering and reballing operations.
Whether you're reflowing solder balls, positioning BGA stencils, or organizing tiny IC chips, this magnetic-compatible mat keeps your workspace tidy and your parts secure. Its durable silicone construction withstands the high temperatures typical of rework stations, protecting your bench and your components simultaneously.
Key Features
- Non-Slip Surface: Silicone grip keeps BGA stencils, ICs, and small components firmly in place during precision rework.
- Heat Resistant: Engineered silicone material handles the elevated temperatures of soldering and hot-air rework without warping or degrading.
- Magnetic Compatible: Works seamlessly alongside magnetic tools and fixtures for even more controlled rework setups.
- Compact Size: 6 × 8 cm (approx. 2.36 × 3.14 in) — perfectly sized for a desktop rework station without taking up unnecessary space.
- Easy to Clean: Smooth silicone surface resists flux residue and solder splatter; simply wipe clean after use.
- Versatile Use: Compatible with CPU IC BGA reballing, stencil alignment, and general SMD rework tasks.
Specifications
- Material: Silicone
- Size: 6 × 8 cm / 2.36 × 3.14 in
- Color: Orange
- Quantity: 1 pc
- Country of Origin: Made in China
Package Contents
- 1 × PD-C BGA Reballing Silicone Mat
Note: Photos may not reflect the actual size; please refer to the dimensions listed above. Allow ±5–10 mm variance due to manual measurement. Actual color may vary slightly from screen to screen.
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Frequently Asked Questions
Q: What is the BGA reballing silicone mat used for?
A: The BGA reballing silicone mat provides a non-slip, heat-resistant work surface for CPU, IC, and BGA chip rework tasks. It holds stencils and components in position during soldering, reballing, and hot-air rework processes, helping technicians achieve precise, reliable results.
Q: Is this silicone mat compatible with magnetic rework fixtures?
A: Yes. The mat is designed to be magnetic-compatible, meaning it can be used alongside magnetic rework fixtures, stencil holders, and component trays for an even more organized and controlled reballing setup.
Q: What temperature range can this silicone mat withstand?
A: The mat is made from heat-resistant silicone that is built to handle the elevated temperatures typical of soldering irons, hot-air rework stations, and reflow processes, making it safe and durable for everyday electronics repair use.
Q: What are the dimensions of this reballing mat?
A: The mat measures 6 × 8 cm (approximately 2.36 × 3.14 inches), making it a compact yet functional addition to any electronics rework station. Please allow ±5–10 mm variance due to manual measurement.
Production & Packaging Notice
To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.